Diamond grinding wheels of Silicon polishing applications

- Nov 23, 2016-

the current

Cutting wafer plant root speed due to come in, the operator in the actual work, as long as the slightest negligence will result in poor cutting quality of the silicon block. Main categories: cutting saw marks on the surface of Silicon Silicon blocks the size of middle "bulge"; disconnection caused local Silicon in the shape of bending. Workshops present the brush wheel is not completely removed due to cutting kerf; "bulging" problem the silicon block, because of limited wheel polishing brush type, middle size cannot be removed. Needed a better grinding ability of grinding wheel.